PCB – Most Common Issues


PCB – Most Common Issues

With so many PCB manufacturers in the market, we always look for one who is perfect and least prone to making mistakes. This is why the main goal of PCB manufacturers is to build a PCB assembly from India that is devoid of all possible defects. This can be achieved when they have an in-depth understanding of the most common PCB design mistakes, the most common defects, the root causes, and the prevention methods. Understanding and avoiding all such faults paves the way towards creating a high quality fault-free PCB assembly.

Physical damage

Physical damage of the PCB can be caused due to environmental stress or dropping of the board in the prototyping phase. Such damage made to the components is not easily visible, and is also not repairable. Thus, this is one condition which cannot be resolved. It will only have to be replaced. To avoid such damage, it is important that care is taken when handling the PCB at every stage.

Electromagnetic issues

Electromagnetic compatibility and electromagnetic interference are two common electromagnetic issues. The former is a problem with the generation and propagation of electromagnetic energy, while the latter is the damaging effect of the electromagnetic compatibility. These problems may arise due to certain design issues, which can be reduced by increasing the ground area of the PCB.

Solder bridges

Solder bridging occurs when a solder crosses one lead over another, or the PCB has an abnormal connection between two or more adjacent traces. These issues may not be easily visible as they may be too tiny, and difficult to detect. The condition may prove to be highly fatal for the PCB as they may blow up or burn the components and traces, thus causing serious damage. This is why it is very important to prevent this condition from occurring; and this can be done by either adding a solder mask between the pads, or ensuring zero gaps between the PCB and stencil.

Plating voids

Plated through holes in the PCB are responsible for carrying electricity from one side of the board to the other. The walls of these holes are electroplated during the fabrication process, after the board is made conductive by copper deposition from top to bottom, by electro-less copper being adhered to the edges of the circuit board and within the holes. Any problems in the copper deposition can result in plating voids, meaning that the walls are not coated evenly with copper, which affects the flow of electricity. The reason behind the uneven coating could be air bubbles, contaminated holes, or material contamination. Thus, this condition can be prevented by cleaning the material thoroughly before and after drilling.

Acid traps

Solder leakage is another problem that may occur at the time of assembling. Known as acid traps in technical language, the condition is caused due to error in via positioning. It can be solved by using a non-conductive epoxy, or by applying the solder mask over the holes.


Solder joints that are not extended to the PCB joints do not obtain a good solder joint fillet. This condition is known as de-wetting. It occurs when the solder partially covers a board surface, while leaving behind exposed copper, which directly affects the quality of solder joints. To avoid this issue, the storage environment must be monitored, and kept free of humidity and extreme temperatures.

All these issues can be avoided if the PCB manufacturing is left in the hands of reliable manufacturers who have excellent technical skills and precision. One such manufacturer of the best PCB assembly from India is Miracle Aerospace, who has a vast industry experience that offers the best PCB solutions to every specific requirement.